The 2nd Taipei-Sydney Semiconductor Bootcamp 2026
Dual-Stream Semiconductor Training Program in Taiwan
IC Design • Advanced Packaging • Industry Visits
Bootcamp Highlights
Dual-Stream Training
Two learning tracks tailored for participants with different academic backgrounds.
Advanced Packaging Lab
Hands-on demonstrations in semiconductor packaging technologies.
Industry Experts
Lectures from semiconductor leaders and former TSMC researchers.
Industry Visits
Visit Hsinchu Science Park and leading semiconductor companies.
Program Overview
| Location | Taipei & Hsinchu, Taiwan |
|---|---|
| Organisers |
National Taiwan University of Science and Technology (NTUST) Research & Prototype Foundry – University of Sydney |
| Sponsors |
Semiconductor Sector Service Bureau (S3B) CruxML AMRF (TBC) |
Course Dates
Group A
June 22 – June 26, 2026
Participants with semiconductor background.
Group B
June 29 – July 3, 2026
Participants new to semiconductor technology.
Fees
Tuition Fee
NT$40,000 / USD 1,300
NT$40,000 / USD 1,300
- Includes tuition and course materials
- Includes transportation for site visits
- Includes selected meals and certificate
- Accommodation not included
Accommodation
NTUST International House (Recommended)
- Convenient campus location
- Easy transportation coordination
- Better safety management
- Cross-cultural interaction opportunities
| Room Type | Occupancy | Price |
|---|---|---|
| Twin Room | 2 persons | NT$1,100 |
| Quad Room | 4 persons | NT$900 |
Application Information
Registration period: February 1 – May 20, 2026
Early bird discount available until March 31, 2026
Payment deadline: May 26, 2026
Early bird discount available until March 31, 2026
Payment deadline: May 26, 2026
